TSMC Podcasts

TSMC rarely gets a podcast episode to itself. More often, it surfaces midway through broader conversations about processors, AI infrastructure, manufacturing capacity, or the companies competing around it. That makes the coverage useful for context, but frustrating if you want a sustained TSMC deep dive.

The clearest dedicated episode

OverVolted provides the strongest starting point with Overvolted #26 - TSMC Capacity, Radeon 6700XT, NVIDIA BAR Support, Intel i7-11700K, GloFlo Expansion. It is the only episode here that puts TSMC in the title, and even then the company shares the billing with a crowded hardware agenda.

That rundown format is revealing: podcast discussion tends to treat TSMC as one consequential part of an interconnected industry story. For listeners who already follow graphics cards, processors, and fabrication news, that density may be exactly the attraction.

Where TSMC enters the wider chip conversation

Elsewhere, the references are mostly incidental. The Circuit places them among discussions of datacenters, custom silicon, earnings, and infrastructure. The surrounding territory is apparent in, for example, EP 159: MediaTek and the Evolving Custom ASIC Business, More Memory Pain, and More and EP 156: Evolving Dynamics of AI Infrastructure, Open Source Agents, Meta's ASIC Roadmap, but neither promises a TSMC-focused treatment.

The TechStack takes a similarly company-heavy route. Tech Earnings Deep Dive: Intel, AMD, Qualcomm & NVIDIA Futures is useful if you want TSMC mentioned within a discussion of major chip businesses rather than examined on its own. Its MediaTek's 2026 Masterplan: Data Centers, Compute & The Future of IoT offers another adjacent entry point.

For a more consumer-facing frame, Rene Ritchie approaches silicon through platform competition. Apple vs Intel vs Qualcomm - Who wins 2023! and The End of Big Silicon - Apple, Intel, Qualcomm put the emphasis on familiar technology companies. TSMC is supporting context here, not the headline subject.

From fabrication to AI infrastructure

The most promising secondary angle is advanced packaging. 6Pages Market Shifts explicitly asks 3 Shifts Edition (Apr 10 2026): Anthropic's Mythos and Project Glasswing, Is advanced chip packaging the next AI bottleneck?, The business of weather modification. It is a wide-ranging episode, but the packaging question gives listeners a concrete route into the industrial constraints surrounding AI hardware.

Possible moves farther outward with The grid(lock) slowing AI down. Its measured, analytical conversation style suits listeners interested in infrastructure and bottlenecks, though the title offers no reason to expect extended TSMC coverage.

Where to start

Begin with OverVolted and Overvolted #26 - TSMC Capacity, Radeon 6700XT, NVIDIA BAR Support, Intel i7-11700K, GloFlo Expansion for the only plainly signposted TSMC discussion.

Then try 6Pages Market Shifts for the advanced-packaging angle, or The Circuit if you prefer fast-moving semiconductor and AI-infrastructure analysis. Choose Rene Ritchie when the competition among recognizable technology companies matters more than a dedicated company profile.

Featured shows below are part of the PlayNext catalog. Updated weekly.